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Latest Broadcom collaborations

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01 · Sep 13, 2026

Anthropic expands compute partnership with Google and Broadcom

Anthropic signed an agreement with Google and Broadcom for multiple gigawatts of next-generation TPU capacity expected to come online starting in 2027, supporting future Claude models and customer demand.

Official collaboration · Global
02 · Sep 12, 2026

Meta and Broadcom expand partnership to co-develop custom AI silicon

Meta and Broadcom expanded their strategic partnership to co-develop multiple generations of custom AI accelerator chips, including work across chip design, advanced packaging and networking.

Official collaboration · Global
03 · Sep 11, 2026

Apple and Broadcom multiyear custom-silicon and wireless-connectivity agreement

Apple and Broadcom announced a new multiyear agreement covering custom silicon components and wireless-connectivity technologies, with Broadcom expanding U.S. manufacturing capacity.

Happening now · Fort Collins, Colorado
04 · Sep 9, 2026

Broadcom and Meta extend partnership for custom AI silicon

Broadcom and Meta announced a multi-year, multi-generation partnership supporting Meta’s MTIA custom AI accelerators, including planned collaboration on next-generation chips through 2029.

Happening now · Global
05 · Sep 9, 2026

Broadcom and Samsung collaborate on integrated 5G and Wi-Fi 8 FWA platform

Broadcom announced an integrated 5G and Wi-Fi 8 fixed-wireless-access platform developed in collaboration with Samsung Electronics.

Official collaboration · Global
06 · Sep 9, 2026

OpenAI and Broadcom announce strategic collaboration for custom AI accelerators

OpenAI and Broadcom will co-develop and deploy accelerator and Ethernet network systems supporting 10 gigawatts of custom AI infrastructure.

Happening now · Global
07 · Sep 4, 2026

Samsung and Broadcom expand strategic collaboration across memory and foundry technologies

Samsung and Broadcom signed an MOU to broaden collaboration on next-generation AI infrastructure, including HBM memory, foundry technologies and advanced packaging.

Official collaboration · San Francisco

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